With the rapid growth of electric vehicles (EV/HEV), industrial power electronics, and renewable energy systems, thermal performance and reliability are critical to power module design. Al–SiC (Aluminum–Silicon Carbide) MMC baseplates are widely adopted by Tier-1 manufacturers for their excellent thermal management and structural stability.
Al–SiC combines an aluminum matrix with silicon carbide (SiC) reinforcement. By adjusting the SiC content, the material achieves a balanced combination of high thermal conductivity, controlled CTE, high stiffness, and lightweight characteristics, making it ideal for high-power module applications.
Nexteck supplies high-quality Al–SiC baseplates for automotive and industrial power modules, supporting efficient heat dissipation, improved reliability, and long service life.
- Tunable CTE (7–17 ×10??/K) for optimal matching with ceramic substrates and power chips
- High thermal conductivity (140–180 W/m·K) for efficient heat dissipation
- Lightweight design compared to copper baseplates
- High stiffness and thermal cycling reliability
- Customizable sizes, thicknesses, and surface finishes (Ni / Ni–P)
- EV traction inverters, OBC, DC/DC converters
- Industrial motor drives and power supplies
- Solar and energy storage inverters


NEXTECK (CHINA) - SHENZHEN
Tower A1001, Galaxy Century, No 3069, CaiTian Rd, Futian District, Shenzhen, China
Zip Code: 518026
Tel: +86-755-8256-1631
Fax:+86-755-8256-1691
E-mail:nexteck@nexteck.com
PRODUCTION PLANT
Wenchuan Rd, Alley 5300/1, Baoshan District, Shanghai, China
Zip Code: 200942
Tel: +86-21-3638-0189
Fax: +86-21-3638-0109
E-mail: nexteck@nexteck.com.cn